Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879212 | Processed stacked dies | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2020-12-29 |
| 10790262 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Rajesh Katkar, Laura Wills Mirkarimi | 2020-09-29 |
| 10727219 | Techniques for processing devices | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2020-07-28 |
| 10707087 | Processing stacked substrates | Cyprian Emeka Uzoh | 2020-07-07 |
| 10623710 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Hong Shen, Liang Wang, Arkalgud R. Sitaram | 2020-04-14 |
| 10586785 | Embedded graphite heat spreader for 3DIC | Charles G. Woychik, Cyprian Emeka Uzoh, Liang Wang | 2020-03-10 |
| 10535564 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Liang Wang, Hong Shen, Arkalgud R. Sitaram | 2020-01-14 |