Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10849240 | Contact structures with porous networks for solder connections, and methods of fabricating same | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2020-11-24 |
| 10653980 | Connection-free filter capsule apparatus | ZhenWu Lin | 2020-05-19 |
| 10629468 | Device packaging using a recyclable carrier substrate | Jiro Yota, Viswanathan Ramanathan | 2020-04-21 |
| 10623710 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Liang Wang, Guilian Gao, Arkalgud R. Sitaram | 2020-04-14 |
| 10586759 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2020-03-10 |
| 10535564 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Guilian Gao, Liang Wang, Arkalgud R. Sitaram | 2020-01-14 |
| 10531574 | Contact structures with porous networks for solder connections, and methods of fabricating same | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2020-01-07 |