Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879212 | Processed stacked dies | Cyprian Emeka Uzoh, Guilian Gao, Gaius Gillman Fountain, Jr. | 2020-12-29 |
| 10790262 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Rajesh Katkar, Guilian Gao | 2020-09-29 |
| 10727219 | Techniques for processing devices | Cyprian Emeka Uzoh, Guilian Gao, Gaius Gillman Fountain, Jr. | 2020-07-28 |
| 10672654 | Microelectronic assembly from processed substrate | Cyprian Emeka Uzoh | 2020-06-02 |
| 10658313 | Selective recess | Javier A. Delacruz, Rajesh Katkar, Shaowu Huang, Gaius Gillman Fountain, Jr., Liang Wang | 2020-05-19 |
| 10586759 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh | 2020-03-10 |