SH

Shaowu Huang

IN Invensas: 2 patents #11 of 37Top 30%
IT Invensas Bonding Technologies: 2 patents #10 of 14Top 75%
XC Xcelsis: 1 patents #11 of 16Top 70%
Overall (2020): #22,495 of 565,922Top 4%
6
Patents 2020

Issued Patents 2020

Patent #TitleCo-InventorsDate
10832912 Direct-bonded native interconnects and active base die Javier A. Delacruz, Steven Teig, William C. Plants, David Edward Fisch 2020-11-10
10784191 Interface structures and methods for forming same Belgacem Haba, Javier A. Delacruz 2020-09-22
10719649 Full wave modeling and simulations of the waveguide behavior of printed circuit boards using a broadband green's function technique Leung W. Tsang 2020-07-21
10658302 Wire bonding method and apparatus for electromagnetic interference shielding Javier A. Delacruz 2020-05-19
10658313 Selective recess Javier A. Delacruz, Rajesh Katkar, Gaius Gillman Fountain, Jr., Liang Wang, Laura Wills Mirkarimi 2020-05-19
10535909 Methods of forming flipped RF filter components Belgacem Haba 2020-01-14