Issued Patents 2020
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879210 | Bonded structures | Paul M. Enquist, Liang Wang, Rajesh Katkar, Arkalgud R. Sitaram | 2020-12-29 |
| 10879207 | Bonded structures | Liang Wang, Rajesh Katkar, Arkalgud R. Sitaram | 2020-12-29 |
| 10832912 | Direct-bonded native interconnects and active base die | Steven Teig, Shaowu Huang, William C. Plants, David Edward Fisch | 2020-11-10 |
| 10790222 | Bonding of laminates with electrical interconnects | Belgacem Haba, Wael Zohni, Liang Wang, Akash Agrawal | 2020-09-29 |
| 10784191 | Interface structures and methods for forming same | Shaowu Huang, Belgacem Haba | 2020-09-22 |
| 10748824 | Probe methodology for ultrafine pitch interconnects | Paul M. Enquist, Gaius Gillman Fountain, Jr., Ilyas Mohammed | 2020-08-18 |
| 10719762 | Three dimensional chip structure implementing machine trained network | Steven Teig, Kenneth Duong | 2020-07-21 |
| 10700094 | Device disaggregation for improved performance | Don Draper, Jung Ko, Steven Teig | 2020-06-30 |
| 10684929 | Self healing compute array | Steven Teig, David Edward Fisch, William C. Plants | 2020-06-16 |
| 10672744 | 3D compute circuit with high density Z-axis interconnects | Steven Teig, Ilyas Mohammed, Kenneth Duong | 2020-06-02 |
| 10672743 | 3D Compute circuit with high density z-axis interconnects | Steven Teig, Ilyas Mohammed, Kenneth Duong | 2020-06-02 |
| 10672745 | 3D processor | Steven Teig, Ilyas Mohammed, Kenneth Duong | 2020-06-02 |
| 10672663 | 3D chip sharing power circuit | Steven Teig, Ilyas Mohammed, Eric Nequist | 2020-06-02 |
| 10664564 | Systems and methods for inter-die block level design | Eric Nequist, Jung Ko, Kenneth Duong | 2020-05-26 |
| 10658313 | Selective recess | Rajesh Katkar, Shaowu Huang, Gaius Gillman Fountain, Jr., Liang Wang, Laura Wills Mirkarimi | 2020-05-19 |
| 10658302 | Wire bonding method and apparatus for electromagnetic interference shielding | Shaowu Huang | 2020-05-19 |
| 10607937 | Increased contact alignment tolerance for direct bonding | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2020-03-31 |
| 10607136 | Time borrowing between layers of a three dimensional chip stack | Steven Teig, Kenneth Duong | 2020-03-31 |
| 10600691 | 3D chip sharing power interconnect layer | Steven Teig, Ilyas Mohammed | 2020-03-24 |
| 10600780 | 3D chip sharing data bus circuit | Steven Teig, Ilyas Mohammed | 2020-03-24 |
| 10600747 | Vertical capacitors for microelectronics | Belgacem Haba | 2020-03-24 |
| 10600735 | 3D chip sharing data bus | Steven Teig, Ilyas Mohammed | 2020-03-24 |
| 10593651 | Systems and methods for flash stacking | Belgacem Haba, Ilyas Mohammed | 2020-03-17 |
| 10593667 | 3D chip with shielded clock lines | Steven Teig, Ilyas Mohammed | 2020-03-17 |
| 10586786 | 3D chip sharing clock interconnect layer | Steven Teig, Ilyas Mohammed, Eric Nequist | 2020-03-10 |