Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10806036 | Pressing of wire bond wire tips to provide bent-over tips | Reynaldo Co, Grant Villavicencio | 2020-10-13 |
| 10790222 | Bonding of laminates with electrical interconnects | Javier A. Delacruz, Belgacem Haba, Liang Wang, Akash Agrawal | 2020-09-29 |
| 10692842 | Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2020-06-23 |
| 10643977 | Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2020-05-05 |
| 10622289 | Stacked chip-on-board module with edge connector | Belgacem Haba | 2020-04-14 |
| 10559537 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Ashok S. Prabhu, Willmar Subido | 2020-02-11 |