Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692842 | Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2020-06-23 |
| 10643977 | Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2020-05-05 |