Issued Patents 2020
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10852545 | Head mounted viewer for AR and VR scenes | Ilyas Mohammed, Rajesh Katkar | 2020-12-01 |
| 10833044 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2020-11-10 |
| 10813214 | Cavities containing multi-wiring structures and devices | Cyprian Emeka Uzoh, Craig Mitchell, Ilyas Mohammed | 2020-10-20 |
| 10811388 | Capacitive coupling in a direct-bonded interface for microelectronic devices | Arkalgud R. Sitaram | 2020-10-20 |
| 10802285 | Remote optical engine for virtual reality or augmented reality headsets | Ilyas Mohammed, Rajesh Katkar | 2020-10-13 |
| 10790222 | Bonding of laminates with electrical interconnects | Javier A. Delacruz, Wael Zohni, Liang Wang, Akash Agrawal | 2020-09-29 |
| 10784191 | Interface structures and methods for forming same | Shaowu Huang, Javier A. Delacruz | 2020-09-22 |
| 10784282 | 3D NAND—high aspect ratio strings and channels | Rajesh Katkar, Xu Chang | 2020-09-22 |
| 10750614 | Deformable electrical contacts with conformable target pads | Gabriel Z. Guevara | 2020-08-18 |
| 10734759 | Configurable smart object system with magnetic contacts and magnetic assembly | Ilyas Mohammed, Gabriel Z. Guevara, Min Tao | 2020-08-04 |
| 10692842 | Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2020-06-23 |
| 10643977 | Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2020-05-05 |
| 10636767 | Correction die for wafer/die stack | — | 2020-04-28 |
| 10622291 | SSI PoP | — | 2020-04-14 |
| 10622289 | Stacked chip-on-board module with edge connector | Wael Zohni | 2020-04-14 |
| 10600747 | Vertical capacitors for microelectronics | Javier A. Delacruz | 2020-03-24 |
| 10600761 | Nanoscale interconnect array for stacked dies | Liang Wang, Bongsub Lee, Sangil Lee | 2020-03-24 |
| 10600760 | Ultrathin layer for forming a capacitive interface between joined integrated circuit component | Arkalgud R. Sitaram | 2020-03-24 |
| 10593563 | Fan-out wafer level package with resist vias | Ilyas Mohammed, Rajesh Katkar | 2020-03-17 |
| 10593651 | Systems and methods for flash stacking | Ilyas Mohammed, Javier A. Delacruz | 2020-03-17 |
| 10593643 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2020-03-17 |
| 10566310 | Microelectronic packages having stacked die and wire bond interconnects | Kyong-Mo Bang | 2020-02-18 |
| 10559494 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Craig Mitchell, Ilyas Mohammed, Piyush Savalia | 2020-02-11 |
| 10535909 | Methods of forming flipped RF filter components | Shaowu Huang | 2020-01-14 |