| 10863127 |
Compressive sensing based image capture using multi-lens array |
— |
2020-12-08 |
| 10852545 |
Head mounted viewer for AR and VR scenes |
Rajesh Katkar, Belgacem Haba |
2020-12-01 |
| 10833044 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2020-11-10 |
| 10813214 |
Cavities containing multi-wiring structures and devices |
Cyprian Emeka Uzoh, Craig Mitchell, Belgacem Haba |
2020-10-20 |
| 10802285 |
Remote optical engine for virtual reality or augmented reality headsets |
Belgacem Haba, Rajesh Katkar |
2020-10-13 |
| 10804151 |
Systems and methods for producing flat surfaces in interconnect structures |
Cyprian Emeka Uzoh, Vage Oganesian |
2020-10-13 |
| 10748824 |
Probe methodology for ultrafine pitch interconnects |
Javier A. Delacruz, Paul M. Enquist, Gaius Gillman Fountain, Jr. |
2020-08-18 |
| 10748858 |
High yield substrate assembly |
Liang Wang, Masud Beroz |
2020-08-18 |
| 10734759 |
Configurable smart object system with magnetic contacts and magnetic assembly |
Belgacem Haba, Gabriel Z. Guevara, Min Tao |
2020-08-04 |
| 10672663 |
3D chip sharing power circuit |
Javier A. Delacruz, Steven Teig, Eric Nequist |
2020-06-02 |
| 10672743 |
3D Compute circuit with high density z-axis interconnects |
Steven Teig, Kenneth Duong, Javier A. Delacruz |
2020-06-02 |
| 10672744 |
3D compute circuit with high density Z-axis interconnects |
Steven Teig, Kenneth Duong, Javier A. Delacruz |
2020-06-02 |
| 10672745 |
3D processor |
Steven Teig, Kenneth Duong, Javier A. Delacruz |
2020-06-02 |
| 10600735 |
3D chip sharing data bus |
Javier A. Delacruz, Steven Teig |
2020-03-24 |
| 10600780 |
3D chip sharing data bus circuit |
Javier A. Delacruz, Steven Teig |
2020-03-24 |
| 10600691 |
3D chip sharing power interconnect layer |
Javier A. Delacruz, Steven Teig |
2020-03-24 |
| 10593643 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2020-03-17 |
| 10593563 |
Fan-out wafer level package with resist vias |
Belgacem Haba, Rajesh Katkar |
2020-03-17 |
| 10593667 |
3D chip with shielded clock lines |
Javier A. Delacruz, Steven Teig |
2020-03-17 |
| 10593651 |
Systems and methods for flash stacking |
Belgacem Haba, Javier A. Delacruz |
2020-03-17 |
| 10586786 |
3D chip sharing clock interconnect layer |
Javier A. Delacruz, Steven Teig, Eric Nequist |
2020-03-10 |
| 10580757 |
Face-to-face mounted IC dies with orthogonal top interconnect layers |
Eric Nequist, Steven Teig, Javier A. Delacruz, Laura Mirkarimi |
2020-03-03 |
| 10580735 |
Stacked IC structure with system level wiring on multiple sides of the IC die |
Steven Teig, Javier A. Delacruz |
2020-03-03 |
| 10559494 |
Microelectronic elements with post-assembly planarization |
Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia |
2020-02-11 |
| 10529634 |
Probe methodology for ultrafine pitch interconnects |
Javier A. Delacruz, Paul M. Enquist, Gaius Gillman Fountain, Jr. |
2020-01-07 |