Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847469 | CTE compensation for wafer-level and chip-scale packages and assemblies | Kenneth Vanhille, Aaron C. Caba, Jared W. Jordan, Timothy Amis Smith, Anatoliy O. Boryssenko +1 more | 2020-11-24 |
| 10748858 | High yield substrate assembly | Liang Wang, Ilyas Mohammed | 2020-08-18 |