Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879210 | Bonded structures | Liang Wang, Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2020-12-29 |
| 10879226 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Arkalgud R. Sitaram | 2020-12-29 |
| 10777533 | Heterogeneous device | Gaius Gillman Fountain, Jr. | 2020-09-15 |
| 10748824 | Probe methodology for ultrafine pitch interconnects | Javier A. Delacruz, Gaius Gillman Fountain, Jr., Ilyas Mohammed | 2020-08-18 |
| 10607937 | Increased contact alignment tolerance for direct bonding | Gaius Gillman Fountain, Jr., Javier A. Delacruz | 2020-03-31 |
| 10529634 | Probe methodology for ultrafine pitch interconnects | Javier A. Delacruz, Gaius Gillman Fountain, Jr., Ilyas Mohammed | 2020-01-07 |