Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879212 | Processed stacked dies | Cyprian Emeka Uzoh, Guilian Gao, Laura Wills Mirkarimi | 2020-12-29 |
| 10840205 | Chemical mechanical polishing for hybrid bonding | Chandrasekhar Mandalapu, Cyprian Emeka Uzoh, Jeremy Alfred Theil | 2020-11-17 |
| 10777533 | Heterogeneous device | Paul M. Enquist | 2020-09-15 |
| 10748824 | Probe methodology for ultrafine pitch interconnects | Javier A. Delacruz, Paul M. Enquist, Ilyas Mohammed | 2020-08-18 |
| 10727219 | Techniques for processing devices | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Guilian Gao | 2020-07-28 |
| 10658313 | Selective recess | Javier A. Delacruz, Rajesh Katkar, Shaowu Huang, Liang Wang, Laura Wills Mirkarimi | 2020-05-19 |
| 10607937 | Increased contact alignment tolerance for direct bonding | Paul M. Enquist, Javier A. Delacruz | 2020-03-31 |
| 10529634 | Probe methodology for ultrafine pitch interconnects | Javier A. Delacruz, Paul M. Enquist, Ilyas Mohammed | 2020-01-07 |