Issued Patents 2020
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879226 | Stacked dies and methods for forming bonded structures | Arkalgud R. Sitaram, Paul M. Enquist | 2020-12-29 |
| 10879212 | Processed stacked dies | Guilian Gao, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2020-12-29 |
| 10849240 | Contact structures with porous networks for solder connections, and methods of fabricating same | Liang Wang, Rajesh Katkar, Hong Shen | 2020-11-24 |
| 10840205 | Chemical mechanical polishing for hybrid bonding | Gaius Gillman Fountain, Jr., Chandrasekhar Mandalapu, Jeremy Alfred Theil | 2020-11-17 |
| 10840135 | Flat metal features for microelectronics applications | — | 2020-11-17 |
| 10818629 | Tall and fine pitch interconnects | Rajesh Katkar | 2020-10-27 |
| 10813214 | Cavities containing multi-wiring structures and devices | Craig Mitchell, Belgacem Haba, Ilyas Mohammed | 2020-10-20 |
| 10804151 | Systems and methods for producing flat surfaces in interconnect structures | Vage Oganesian, Ilyas Mohammed | 2020-10-13 |
| 10796936 | Die tray with channels | — | 2020-10-06 |
| 10790262 | Low temperature bonded structures | Jeremy Alfred Theil, Liang Wang, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2020-09-29 |
| 10727219 | Techniques for processing devices | Laura Wills Mirkarimi, Guilian Gao, Gaius Gillman Fountain, Jr. | 2020-07-28 |
| 10714449 | Die processing | — | 2020-07-14 |
| 10707087 | Processing stacked substrates | Guilian Gao | 2020-07-07 |
| 10700002 | Ultra high performance interposer | Zhuowen Sun | 2020-06-30 |
| 10672654 | Microelectronic assembly from processed substrate | Laura Wills Mirkarimi | 2020-06-02 |
| 10629567 | Multiple plated via arrays of different wire heights on same substrate | Rajesh Katkar | 2020-04-21 |
| 10629577 | Direct-bonded LED arrays and applications | Min Tao, Liang Wang, Rajesh Katkar | 2020-04-21 |
| 10586785 | Embedded graphite heat spreader for 3DIC | Guilian Gao, Charles G. Woychik, Liang Wang | 2020-03-10 |
| 10586759 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Laura Wills Mirkarimi | 2020-03-10 |
| 10535564 | Structures and methods for reliable packages | Guilian Gao, Liang Wang, Hong Shen, Arkalgud R. Sitaram | 2020-01-14 |
| 10535626 | Structures and methods for low temperature bonding using nanoparticles | — | 2020-01-14 |
| 10531574 | Contact structures with porous networks for solder connections, and methods of fabricating same | Liang Wang, Rajesh Katkar, Hong Shen | 2020-01-07 |