Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879207 | Bonded structures | Liang Wang, Rajesh Katkar, Javier A. Delacruz | 2020-12-29 |
| 10879226 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Paul M. Enquist | 2020-12-29 |
| 10879210 | Bonded structures | Paul M. Enquist, Liang Wang, Rajesh Katkar, Javier A. Delacruz | 2020-12-29 |
| 10811388 | Capacitive coupling in a direct-bonded interface for microelectronic devices | Belgacem Haba | 2020-10-20 |
| 10623710 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Hong Shen, Liang Wang, Guilian Gao | 2020-04-14 |
| 10600760 | Ultrathin layer for forming a capacitive interface between joined integrated circuit component | Belgacem Haba | 2020-03-24 |
| 10546832 | Bonded structures | Liang Wang, Rajesh Katkar, Javier A. Delacruz | 2020-01-28 |
| 10535564 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Guilian Gao, Liang Wang, Hong Shen | 2020-01-14 |