Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672663 | 3D chip sharing power circuit | Javier A. Delacruz, Steven Teig, Ilyas Mohammed | 2020-06-02 |
| 10664564 | Systems and methods for inter-die block level design | Javier A. Delacruz, Jung Ko, Kenneth Duong | 2020-05-26 |
| 10586786 | 3D chip sharing clock interconnect layer | Javier A. Delacruz, Steven Teig, Ilyas Mohammed | 2020-03-10 |
| 10580757 | Face-to-face mounted IC dies with orthogonal top interconnect layers | Steven Teig, Javier A. Delacruz, Ilyas Mohammed, Laura Mirkarimi | 2020-03-03 |