BL

Bongsub Lee

IN Invensas: 1 patents #17 of 37Top 50%
Overall (2020): #532,009 of 565,922Top 95%
1
Patents 2020

Issued Patents 2020

Patent #TitleCo-InventorsDate
10600761 Nanoscale interconnect array for stacked dies Liang Wang, Belgacem Haba, Sangil Lee 2020-03-24