Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10806036 | Pressing of wire bond wire tips to provide bent-over tips | Grant Villavicencio, Wael Zohni | 2020-10-13 |
| 10756049 | Package-on-package assembly with wire bond vias | Ellis Chau, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2020-08-25 |