Issued Patents 2020
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10580757 | Face-to-face mounted IC dies with orthogonal top interconnect layers | Eric Nequist, Steven Teig, Ilyas Mohammed, Laura Mirkarimi | 2020-03-03 |
| 10580735 | Stacked IC structure with system level wiring on multiple sides of the IC die | Ilyas Mohammed, Steven Teig | 2020-03-03 |
| 10546832 | Bonded structures | Liang Wang, Rajesh Katkar, Arkalgud R. Sitaram | 2020-01-28 |
| 10529634 | Probe methodology for ultrafine pitch interconnects | Paul M. Enquist, Gaius Gillman Fountain, Jr., Ilyas Mohammed | 2020-01-07 |