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Selective removal process to create high aspect ratio fully self-aligned via |
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| 10727119 |
Process integration approach of selective tungsten via fill |
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2020-07-28 |
| 10707122 |
Methods for depositing dielectric barrier layers and aluminum containing etch stop layers |
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| 10692734 |
Methods of patterning nickel silicide layers on a semiconductor device |
Jong Mun Kim, Chentsau Chris Ying, Srinivas D. Nemani, Ellie Yieh |
2020-06-23 |
| 10692759 |
Methods for manufacturing an interconnect structure for semiconductor devices |
Hao Jiang, Hao Chen, Mehul Naik |
2020-06-23 |
| 10685849 |
Damage free metal conductor formation |
Jong Mun Kim, Maximillian Clemons, Minrui Yu, Mehul Naik, Chentsau Chris Ying |
2020-06-16 |
| 10651043 |
Process integration method to tune resistivity of nickel silicide |
Minrui Yu, Mehul Naik |
2020-05-12 |
| 10643895 |
Self-aligned interconnects formed using subtractive techniques |
Bencherki Mebarki, Huixiong Dai, Yongmei Chen, Mehul Naik |
2020-05-05 |
| 10636704 |
Seam-healing method upon supra-atmospheric process in diffusion promoting ambient |
Bencherki Mebarki, Sean S. Kang, Keith Tatseun Wong, Mehul Naik, Ellie Yieh +1 more |
2020-04-28 |
| 10546742 |
Method to reduce trap-induced capacitance in interconnect dielectric barrier stack |
Mehul Naik, Yong Cao, Yana Cheng, Weifeng YE |
2020-01-28 |
