Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707122 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Sree Rangasai V. Kesapragada, Kevin Moraes, Srinivas Guggilla, He Ren, Mehul Naik +6 more | 2020-07-07 |
| 10665426 | Methods for thin film material deposition using reactive plasma-free physical vapor deposition | Zhefeng Li, Chi Hong Ching, Yong Cao, Rongjun Wang | 2020-05-26 |
| 10546742 | Method to reduce trap-induced capacitance in interconnect dielectric barrier stack | He Ren, Mehul Naik, Yong Cao, Weifeng YE | 2020-01-28 |