Issued Patents 2020
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847463 | Seed layers for copper interconnects | Zhiyuan Wu, Meng Chu Tseng, Ben-Li Sheu | 2020-11-24 |
| 10727119 | Process integration approach of selective tungsten via fill | He Ren, Feiyue Ma, Yu Lei, Kai Wu, Zhiyuan Wu +2 more | 2020-07-28 |
| 10707122 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Sree Rangasai V. Kesapragada, Kevin Moraes, Srinivas Guggilla, He Ren, David Thompson +6 more | 2020-07-07 |
| 10692759 | Methods for manufacturing an interconnect structure for semiconductor devices | Hao Jiang, He Ren, Hao Chen | 2020-06-23 |
| 10685849 | Damage free metal conductor formation | He Ren, Jong Mun Kim, Maximillian Clemons, Minrui Yu, Chentsau Chris Ying | 2020-06-16 |
| 10651043 | Process integration method to tune resistivity of nickel silicide | He Ren, Minrui Yu | 2020-05-12 |
| 10643895 | Self-aligned interconnects formed using subtractive techniques | Bencherki Mebarki, Huixiong Dai, Yongmei Chen, He Ren | 2020-05-05 |
| 10636704 | Seam-healing method upon supra-atmospheric process in diffusion promoting ambient | Bencherki Mebarki, Sean S. Kang, Keith Tatseun Wong, He Ren, Ellie Yieh +1 more | 2020-04-28 |
| 10593592 | Laminate and core shell formation of silicide nanowire | Bencherki Mebarki, Annamalai Lakshmanan, Kaushal K. Singh, Paul F. Ma, Andrew Cockburn +1 more | 2020-03-17 |
| 10566188 | Method to improve film stability | Maximillian Clemons, Michel R. Frei, Mahendra Pakala, Srinivas D. Nemani, Ellie Yieh | 2020-02-18 |
| 10546742 | Method to reduce trap-induced capacitance in interconnect dielectric barrier stack | He Ren, Yong Cao, Yana Cheng, Weifeng YE | 2020-01-28 |