Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847463 | Seed layers for copper interconnects | Meng Chu Tseng, Mehul Naik, Ben-Li Sheu | 2020-11-24 |
| 10727119 | Process integration approach of selective tungsten via fill | He Ren, Feiyue Ma, Yu Lei, Kai Wu, Mehul Naik +2 more | 2020-07-28 |