Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707122 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Sree Rangasai V. Kesapragada, Kevin Moraes, He Ren, Mehul Naik, David Thompson +6 more | 2020-07-07 |
| 10700087 | Multi-layer stacks for 3D NAND extendibility | Xinhai Han, Deenesh Padhi, Er-Xuan Ping | 2020-06-30 |