| 10492019 |
Binaural audio calibration |
Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo, Aldis Sipolins |
2019-11-26 |
| 10475878 |
BEOL capacitor through airgap metallization |
Marc A. Bergendahl, James J. Demarest, Christopher J. Waskiewicz |
2019-11-12 |
| 10453793 |
BEOL vertical fuse formed over air gap |
Marc A. Bergendahl, James J. Demarest, Christopher J. Waskiewicz |
2019-10-22 |
| 10395985 |
Self aligned conductive lines with relaxed overlay |
Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot +2 more |
2019-08-27 |
| 10388525 |
Multi-angled deposition and masking for custom spacer trim and selected spacer removal |
Marc A. Bergendahl, Sean D. Burns, Lawrence A. Clevenger, Michael Rizzolo |
2019-08-20 |
| 10366940 |
Air gap and air spacer pinch off |
Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini |
2019-07-30 |
| 10366952 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2019-07-30 |
| 10361117 |
Selective ILD deposition for fully aligned via with airgap |
Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha |
2019-07-23 |
| 10361157 |
Method of manufacturing self-aligned interconnects by deposition of a non-conformal air-gap forming layer having an undulated upper surface |
Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo |
2019-07-23 |
| 10361079 |
Multi-angled deposition and masking for custom spacer trim and selected spacer removal |
Marc A. Bergendahl, Sean D. Burns, Lawrence A. Clevenger, Michael Rizzolo |
2019-07-23 |
| 10347825 |
Selective deposition and nitridization of bottom electrode metal for MRAM applications |
Benjamin D. Briggs, Joe Lee, Michael Rizzolo, Chih-Chao Yang |
2019-07-09 |
| 10312434 |
Selective deposition and nitridization of bottom electrode metal for MRAM applications |
Benjamin D. Briggs, Joe Lee, Michael Rizzolo, Chih-Chao Yang |
2019-06-04 |
| 10283586 |
Capacitors |
Veeraraghavan S. Basker, Kangguo Cheng, Theodorus E. Standaert, Junli Wang |
2019-05-07 |
| 10256191 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration |
Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Takeshi Nogami, Michael Rizzolo |
2019-04-09 |
| 10256171 |
Air gap and air spacer pinch off |
Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini |
2019-04-09 |
| 10242933 |
Air gap and air spacer pinch off |
Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini |
2019-03-26 |
| 10229851 |
Self-forming barrier for use in air gap formation |
Benjamin D. Briggs, Elbert E. Huang, Takeshi Nogami |
2019-03-12 |
| 10229967 |
High-density MIM capacitors |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2019-03-12 |
| 10177076 |
Air gap and air spacer pinch off |
Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini |
2019-01-08 |
| 10170416 |
Selective blocking boundary placement for circuit locations requiring electromigration short-length |
Benjamin D. Briggs, Elbert E. Huang, Joe Lee |
2019-01-01 |
| 10170540 |
Capacitors |
Veeraraghavan S. Basker, Kangguo Cheng, Theodorus E. Standaert, Junli Wang |
2019-01-01 |
| 10170411 |
Airgap protection layer for via alignment |
Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo |
2019-01-01 |
