| 10508961 |
Semiconductor package with air pressure sensor |
Kevin Lin, Qing Ma, Johanna M. Swan, Weng Hong Teh |
2019-12-17 |
$31,829,000 |
| 10492267 |
Display for stretchable computing device |
Adel A. Elsherbini, Sasha N. Oster, Nadine L. Dabby, Aleksandar Aleksov, Braxton Lathrop |
2019-11-26 |
$25,149,000 |
| 10475736 |
Via architecture for increased density interface |
Aleksandar Aleksov, Arnab Sarkar, Arghya Sain, Kristof Darmawikarta, Henning Braunisch +3 more |
2019-11-12 |
$21,873,000 |
| 10453635 |
Package MEMS switch and method |
Qing Ma, Johanna M. Swan, Valluri Rao |
2019-10-22 |
$16,310,000 |
| 10432167 |
Piezoelectric package-integrated crystal devices |
Adel A. Elsherbini, Baris Bicen, Telesphor Kamgaing, Vijay K. Nair, Johanna M. Swan +2 more |
2019-10-01 |
$22,201,000 |
| 10424559 |
Thermal management of molded packages |
Nader N. Abazarnia, Johanna M. Swan, Taesha D. Beasley, Sasha N. Oster, Tannaz Harirchian +1 more |
2019-09-24 |
$28,939,000 |
| 10418605 |
Embedded formation of wearable and flexible batteries |
Veronica Strong, Sasha N. Oster, Aranzazu MAESTRE CARO |
2019-09-17 |
$19,673,000 |
| 10410939 |
Package power delivery using plane and shaped vias |
Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Mihir K. Roy, Aleksandar Aleksov +4 more |
2019-09-10 |
$24,704,000 |
| 10386204 |
Integrated sensor and homologous calibration structure for resonant devices |
Sasha N. Oster, Thomas L. Sounart, Georgios Dogiamis |
2019-08-20 |
$17,708,000 |
| 10381291 |
Lithographacally defined vias for organic package substrate scaling |
Adel A. Elsherbini, Henning Braunisch, Brandon M. Rawlings, Aleksandar Aleksov, Javier Soto |
2019-08-13 |
$24,877,000 |
| 10361142 |
Dual-sided die packages |
Henning Braunisch, Adel A. Elsherbini, Johanna M. Swan, Don Nelson |
2019-07-23 |
$32,139,000 |
| 10325860 |
Microelectronic bond pads having integrated spring structures |
Robert L. Sankman, Sandeep B. Sane |
2019-06-18 |
$21,210,000 |
| 10314171 |
Package assembly with hermetic cavity |
Aleksandar Aleksov, Johanna M. Swan |
2019-06-04 |
$21,702,000 |
| 10305019 |
Piezoelectric devices fabricated in packaging build-up layers |
Shawna M. Liff |
2019-05-28 |
$17,387,000 |
| 10291283 |
Tunable radio frequency systems using piezoelectric package-integrated switching devices |
Telesphor Kamgaing, Adel A. Elsherbini, Georgios Dogiamis, Vijay K. Nair, Johanna M. Swan +1 more |
2019-05-14 |
$24,469,000 |
| 10282965 |
Synthetic jet delivering controlled flow to sensor system |
Jessica Gullbrand, Melissa A. Cowan, Chytra Pawashe |
2019-05-07 |
$24,403,000 |
| 10264671 |
Microelectronic devices designed with modular substrates having integrated fuses |
— |
2019-04-16 |
$24,207,000 |
| 10251272 |
Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates |
Aleksandar Aleksov, Thomas L. Sounart, Georgios Dogiamis, Johanna M. Swan |
2019-04-02 |
$26,887,000 |
| 10215164 |
Fabric-based piezoelectric energy harvesting |
Nadine L. Dabby, Adel A. Elsherbini, Braxton Lathrop, Aleksandar Aleksov, Sasha N. Oster |
2019-02-26 |
$20,644,000 |
| 10186465 |
Package-integrated microchannels |
Adel A. Elsherbini, Henning Braunisch, Yidnekachew S. Mekonnen, Krishna Bharath, Mathew J. Manusharow +2 more |
2019-01-22 |
$27,645,000 |
| 10179729 |
Hermetic encapsulation for microelectromechanical systems (MEMS) devices |
Sarah Haney, Weng Hong Teh, Sasha N. Oster |
2019-01-15 |
$38,709,000 |
