Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10424561 | Integrated circuit structures with recessed conductive contacts for package on package | Kyu Oh Lee, Islam A. Salama, Ram Viswanath, Babak Sabi, Sri Chaitra Jyotsna Chavali | 2019-09-24 | $28,939,000 |
| 10416378 | Chip-to-chip interconnect with embedded electro-optical bridge structures | Zhichao Zhang, Kemal Aygun | 2019-09-17 | $19,673,000 |
| 10396046 | Substrate assembly with magnetic feature | Yikang Deng | 2019-08-27 | $17,353,000 |
| 10325860 | Microelectronic bond pads having integrated spring structures | Feras Eid, Sandeep B. Sane | 2019-06-18 | $21,210,000 |
| 10304769 | Multi-die package | Allan A. Ovrom, III, Robert Starkston, Oren Arad | 2019-05-28 | $17,387,000 |
| 10264717 | Electromagnetic interference shields for electronic packages and related methods | — | 2019-04-16 | $24,207,000 |
| 10204851 | High density package interconnects | Sanka Ganesan, Zhiguo Qian, Krishna Srinivasan, Zhaohui Zhu | 2019-02-12 | $25,597,000 |