| 10424561 |
Integrated circuit structures with recessed conductive contacts for package on package |
Kyu Oh Lee, Islam A. Salama, Ram Viswanath, Babak Sabi, Sri Chaitra Jyotsna Chavali |
2019-09-24 |
| 10416378 |
Chip-to-chip interconnect with embedded electro-optical bridge structures |
Zhichao Zhang, Kemal Aygun |
2019-09-17 |
| 10396046 |
Substrate assembly with magnetic feature |
Yikang Deng |
2019-08-27 |
| 10325860 |
Microelectronic bond pads having integrated spring structures |
Feras Eid, Sandeep B. Sane |
2019-06-18 |
| 10304769 |
Multi-die package |
Allan A. Ovrom, III, Robert Starkston, Oren Arad |
2019-05-28 |
| 10264717 |
Electromagnetic interference shields for electronic packages and related methods |
— |
2019-04-16 |
| 10204851 |
High density package interconnects |
Sanka Ganesan, Zhiguo Qian, Krishna Srinivasan, Zhaohui Zhu |
2019-02-12 |