Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366951 | Localized high density substrate routing | Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan | 2019-07-30 |
| 10304769 | Multi-die package | Robert L. Sankman, Allan A. Ovrom, III, Oren Arad | 2019-05-28 |