Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453799 | Logic die and other components embedded in build-up layers | Deepak Kulkarni, Russell K. Mortensen | 2019-10-22 |
| 10366951 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan | 2019-07-30 |
| 10170409 | Package on package architecture and method for making | Sanka Ganesan, Nitesh Nimkar, Klaus Reingruber, Thorsten Meyer | 2019-01-01 |