| 10522485 |
Electrical device and a method for forming an electrical device |
Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Thomas Wagner +1 more |
2019-12-31 |
| 10490527 |
Vertical wire connections for integrated circuit package |
Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Thomas Wagner +1 more |
2019-11-26 |
| 10446541 |
Advanced node cost reduction by ESD interposer |
Georg Seidemann, Christian Geissler |
2019-10-15 |
| 10411000 |
Microelectronic package with illuminated backside exterior |
Marc Dittes, Sven Albers, Christian Geissler, Andreas Wolter, Georg Seidemann +2 more |
2019-09-10 |
| 10403609 |
System-in-package devices and methods for forming system-in-package devices |
Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Thomas Wagner +1 more |
2019-09-03 |
| 10366968 |
Interconnect structure for a microelectronic device |
Andreas Wolter, Georg Seidemann, Thomas Wagner, Bernd Waidhas |
2019-07-30 |
| 10228725 |
Flexible band wearable electronic device |
Sven Albers, Andreas Wolter, Georg Seidemann, Christian Geissler, Thorsten Meyer +1 more |
2019-03-12 |
| 10209466 |
Integrated circuit packages including an optical redistribution layer |
Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes +2 more |
2019-02-19 |
| 10186499 |
Integrated circuit package assemblies including a chip recess |
Georg Seidemann |
2019-01-22 |
| 10170409 |
Package on package architecture and method for making |
Sanka Ganesan, John S. Guzek, Nitesh Nimkar, Thorsten Meyer |
2019-01-01 |