| 10522485 |
Electrical device and a method for forming an electrical device |
Christian Geissler, Sven Albers, Andreas Wolter, Klaus Reingruber, Thomas Wagner +1 more |
2019-12-31 |
| 10522454 |
Microelectronic package having a passive microelectronic device disposed within a package body |
Thorsten Meyer, Gerald Ofner, Andreas Wolter, Sven Albers, Christian Geissler |
2019-12-31 |
| 10490527 |
Vertical wire connections for integrated circuit package |
Christian Geissler, Sven Albers, Andreas Wolter, Klaus Reingruber, Thomas Wagner +1 more |
2019-11-26 |
| 10446541 |
Advanced node cost reduction by ESD interposer |
Christian Geissler, Klaus Reingruber |
2019-10-15 |
| 10431545 |
Cross-connected multi-chip modules coupled by silicon bent-bridge interconnects and methods of assembling same |
Bernd Waidhas, Thomas Wagner, Andreas Wolter, Laurent Millou |
2019-10-01 |
| 10411000 |
Microelectronic package with illuminated backside exterior |
Marc Dittes, Sven Albers, Christian Geissler, Andreas Wolter, Klaus Reingruber +2 more |
2019-09-10 |
| 10403602 |
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory |
Bernd Waidhas, Andreas Augustin, Laurent Millou, Andreas Wolter, Reinhard Mahnkopf +2 more |
2019-09-03 |
| 10403609 |
System-in-package devices and methods for forming system-in-package devices |
Christian Geissler, Sven Albers, Andreas Wolter, Klaus Reingruber, Thomas Wagner +1 more |
2019-09-03 |
| 10373844 |
Integrated circuit package configurations to reduce stiffness |
Sven Albers, Sonja Koller, Thorsten Meyer, Christian Geissler, Andreas Wolter |
2019-08-06 |
| 10366968 |
Interconnect structure for a microelectronic device |
Klaus Reingruber, Andreas Wolter, Thomas Wagner, Bernd Waidhas |
2019-07-30 |
| 10347558 |
Low thermal resistance hanging die package |
Christian Geissler, Sonja Koller, Jan Proschwitz |
2019-07-09 |
| 10319688 |
Antenna on ceramics for a packaged die |
Andreas Wolter, Saravana Maruthamuthu, Mikael Bergholz Knudsen, Thorsten Meyer, Pablo Herrero +1 more |
2019-06-11 |
| 10263106 |
Power mesh-on-die trace bumping |
Bernd Waidhas, Sonja Koller |
2019-04-16 |
| 10228725 |
Flexible band wearable electronic device |
Sven Albers, Klaus Reingruber, Andreas Wolter, Christian Geissler, Thorsten Meyer +1 more |
2019-03-12 |
| 10209466 |
Integrated circuit packages including an optical redistribution layer |
Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes, Klaus Reingruber +2 more |
2019-02-19 |
| 10186499 |
Integrated circuit package assemblies including a chip recess |
Klaus Reingruber |
2019-01-22 |