Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373844 | Integrated circuit package configurations to reduce stiffness | Sven Albers, Thorsten Meyer, Georg Seidemann, Christian Geissler, Andreas Wolter | 2019-08-06 |
| 10347558 | Low thermal resistance hanging die package | Christian Geissler, Georg Seidemann, Jan Proschwitz | 2019-07-09 |
| 10263106 | Power mesh-on-die trace bumping | Bernd Waidhas, Georg Seidemann | 2019-04-16 |