| 10431545 |
Cross-connected multi-chip modules coupled by silicon bent-bridge interconnects and methods of assembling same |
Georg Seidemann, Thomas Wagner, Andreas Wolter, Laurent Millou |
2019-10-01 |
| 10403580 |
Molded substrate package in fan-out wafer level package |
Lizabeth Keser, Thomas Ort, Thomas Wagner |
2019-09-03 |
| 10403602 |
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory |
Georg Seidemann, Andreas Augustin, Laurent Millou, Andreas Wolter, Reinhard Mahnkopf +2 more |
2019-09-03 |
| 10394280 |
Wearable electronic devices and components thereof |
Thorsten Meyer, Dirk Plenkers, Hans-Joachim Barth, Yen Hsiang Chew, Kooi Chi Ooi +1 more |
2019-08-27 |
| 10366968 |
Interconnect structure for a microelectronic device |
Klaus Reingruber, Andreas Wolter, Georg Seidemann, Thomas Wagner |
2019-07-30 |
| 10263106 |
Power mesh-on-die trace bumping |
Sonja Koller, Georg Seidemann |
2019-04-16 |