Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403580 | Molded substrate package in fan-out wafer level package | Lizabeth Keser, Thomas Wagner, Bernd Waidhas | 2019-09-03 |
TO
Thomas Ort — 1 Patent in 2019
Overall (2019): #245,017 of 560,194Top 45%
1
Patents 2019