Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403580 | Molded substrate package in fan-out wafer level package | Lizabeth Keser, Thomas Wagner, Bernd Waidhas | 2019-09-03 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403580 | Molded substrate package in fan-out wafer level package | Lizabeth Keser, Thomas Wagner, Bernd Waidhas | 2019-09-03 |