| 10522485 |
Electrical device and a method for forming an electrical device |
Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more |
2019-12-31 |
| 10490527 |
Vertical wire connections for integrated circuit package |
Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more |
2019-11-26 |
| 10431545 |
Cross-connected multi-chip modules coupled by silicon bent-bridge interconnects and methods of assembling same |
Georg Seidemann, Bernd Waidhas, Andreas Wolter, Laurent Millou |
2019-10-01 |
| 10411000 |
Microelectronic package with illuminated backside exterior |
Marc Dittes, Sven Albers, Christian Geissler, Andreas Wolter, Klaus Reingruber +2 more |
2019-09-10 |
| 10403609 |
System-in-package devices and methods for forming system-in-package devices |
Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more |
2019-09-03 |
| 10403580 |
Molded substrate package in fan-out wafer level package |
Lizabeth Keser, Thomas Ort, Bernd Waidhas |
2019-09-03 |
| 10403602 |
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory |
Bernd Waidhas, Georg Seidemann, Andreas Augustin, Laurent Millou, Andreas Wolter +2 more |
2019-09-03 |
| 10366968 |
Interconnect structure for a microelectronic device |
Klaus Reingruber, Andreas Wolter, Georg Seidemann, Bernd Waidhas |
2019-07-30 |
| 10209466 |
Integrated circuit packages including an optical redistribution layer |
Georg Seidemann, Christian Geissler, Sven Albers, Marc Dittes, Klaus Reingruber +2 more |
2019-02-19 |