| 10522485 |
Electrical device and a method for forming an electrical device |
Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more |
2019-12-31 |
| 10490527 |
Vertical wire connections for integrated circuit package |
Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more |
2019-11-26 |
| 10411000 |
Microelectronic package with illuminated backside exterior |
Sven Albers, Christian Geissler, Andreas Wolter, Klaus Reingruber, Georg Seidemann +2 more |
2019-09-10 |
| 10403609 |
System-in-package devices and methods for forming system-in-package devices |
Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more |
2019-09-03 |
| 10209466 |
Integrated circuit packages including an optical redistribution layer |
Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Klaus Reingruber +2 more |
2019-02-19 |
| 10181439 |
Substrate and method for fabrication thereof |
Carlo Marbella |
2019-01-15 |
