CG

Christian Geissler

IN Intel: 11 patents #165 of 5,769Top 3%
TA Thyssenkrupp Ag: 3 patents #2 of 232Top 1%
TP Thyssenkrupp Presta: 3 patents #1 of 48Top 3%
📍 Teugn, DE: #1 of 2 inventorsTop 50%
Overall (2019): #4,618 of 560,194Top 1%
14
Patents 2019

Issued Patents 2019

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
10522485 Electrical device and a method for forming an electrical device Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber, Thomas Wagner +1 more 2019-12-31
10522454 Microelectronic package having a passive microelectronic device disposed within a package body Thorsten Meyer, Gerald Ofner, Andreas Wolter, Georg Seidemann, Sven Albers 2019-12-31
10490527 Vertical wire connections for integrated circuit package Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber, Thomas Wagner +1 more 2019-11-26
10446541 Advanced node cost reduction by ESD interposer Georg Seidemann, Klaus Reingruber 2019-10-15
10442457 Steering column having an adaptable pivot support Eric Gstöhl, Sven Hausknecht, Stefan-Hermann Loos, Frank Pasch 2019-10-15
10427706 Steering column with a bearing seat which can be mounted in a flexible manner Eric Gstöhl, Sven Hausknecht, Stefan-Hermann Loos, Frank Pasch 2019-10-01
10411000 Microelectronic package with illuminated backside exterior Marc Dittes, Sven Albers, Andreas Wolter, Klaus Reingruber, Georg Seidemann +2 more 2019-09-10
10403609 System-in-package devices and methods for forming system-in-package devices Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber, Thomas Wagner +1 more 2019-09-03
10373844 Integrated circuit package configurations to reduce stiffness Sven Albers, Sonja Koller, Thorsten Meyer, Georg Seidemann, Andreas Wolter 2019-08-06
10370023 Production method for a modular steering column having extruded profiled elements Eric Gstöhl, Sven Hausknecht, Stefan-Hermann Loos, Frank Pasch 2019-08-06
10347558 Low thermal resistance hanging die package Georg Seidemann, Sonja Koller, Jan Proschwitz 2019-07-09
10301176 Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC) Gerald Ofner, Thorsten Meyer, Reinhard Mahnkopf, Andreas Augustin 2019-05-28
10228725 Flexible band wearable electronic device Sven Albers, Klaus Reingruber, Andreas Wolter, Georg Seidemann, Thorsten Meyer +1 more 2019-03-12
10209466 Integrated circuit packages including an optical redistribution layer Georg Seidemann, Sven Albers, Thomas Wagner, Marc Dittes, Klaus Reingruber +2 more 2019-02-19