Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Antenna on ceramics for a packaged die

Antenna on ceramics for a packaged die

US Patent 10319688 · Granted Jun 11, 2019

Estimated economic value: $16,707,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Industrial electrical connector having a data diode module2025
Glass core substrate printed circuit board for warpage reduction2025
System and method of application resource binding2025
Integrated circuit package redistribution layers with metal-insulator-metal (MIM2025
Buried power rails integrated with decoupling capacitance2025
Camera, A-pillar arrangement, and vehicle2025
Bare-die smart bridge connected with copper pillars for system-in-package appara2025
Bare-die smart bridge connected with copper pillars for system-in-package appara2025
Integrated circuit (IC) package employing on-package tunable inductor formed in 2025
Method for fabricating a semiconductor device package comprising a pin in the fo2025
Method to implement wafer-level chip-scale packages with grounded conformal shie2025
Semiconductor dies and devices with frontside and backside coils for inductive c2025