Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit (IC) package employing on-package tunable inductor formed in redistribution layer (RDL) for impedance tuner circuit, and related methods

Integrated circuit (IC) package employing on-package tunable inductor formed in redistribution layer (RDL) for impedance tuner circuit, and related methods

US Patent 12400977 · Granted Aug 26, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Antenna with graded dielectirc and method of making the same2025
Resonant LC tank package and method of manufacture2022
Antenna with graded dielectirc and method of making the same2021
Resonant LC tank package and method of manufacture2021
High-density metal-insulator-metal (MiM) capacitors2020
Component magnetic shielding for microelectronic devices2020
Antenna on ceramics for a packaged die2019
Bulk acoustic wave resonator tuner circuits2017
Semiconductor device with capacitive coupling structure2014