Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396036 | Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices | Yu Zhang, Zhiguo Qian, Kemal Aygun, Yidnekachew S. Mekonnen, Gregorio R. Murtagian +2 more | 2019-08-27 |
| 10204851 | High density package interconnects | Zhiguo Qian, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu | 2019-02-12 |
| 10170409 | Package on package architecture and method for making | John S. Guzek, Nitesh Nimkar, Klaus Reingruber, Thorsten Meyer | 2019-01-01 |