Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396022 | Ground via clustering for crosstalk mitigation | Kemal Aygun, Yu Zhang | 2019-08-27 |
| 10396036 | Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices | Yu Zhang, Kemal Aygun, Yidnekachew S. Mekonnen, Gregorio R. Murtagian, Sanka Ganesan +2 more | 2019-08-27 |
| 10317932 | Capacitive structures for crosstalk reduction | Zhichao Zhang, Xiang Li, Kemal Aygun, Tolga Memioglu | 2019-06-11 |
| 10283453 | Interconnect routing configurations and associated techniques | Kemal Aygun, Dae-Woo Kim | 2019-05-07 |
| 10204851 | High density package interconnects | Sanka Ganesan, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu | 2019-02-12 |