Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453795 | Microprocessor package with first level die bump ground webbing structure | Mathew J. Manusharow, Kemal Aygun, Mohiuddin M. Mazumder | 2019-10-22 |
| 10396022 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Kemal Aygun | 2019-08-27 |
| 10396036 | Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices | Zhiguo Qian, Kemal Aygun, Yidnekachew S. Mekonnen, Gregorio R. Murtagian, Sanka Ganesan +2 more | 2019-08-27 |