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Chip-to-chip interconnect with embedded electro-optical bridge structures |
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Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices |
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Capacitive structures for crosstalk reduction |
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Zhiguo Qian, Dae-Woo Kim |
2019-05-07 |
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