Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510667 | Conductive coating for a microelectronics package | Li-Sheng Weng, Chung-Hao Chen, Emile Davies-Venn, Kemal Aygun | 2019-12-17 |
| 10325866 | Electronic device packages with conformal EMI shielding and related methods | Eric J. Li, Joshua D. Heppner, Rajendra C. Dias | 2019-06-18 |
| 10229887 | Systems and methods for electromagnetic interference shielding | Rajendra C. Dias | 2019-03-12 |
| 10224290 | Electromagnetically shielded electronic devices and related systems and methods | Rajendra C. Dias, Takashi Kumamoto, Yoshishiro Tomita, Joshua D. Heppner, Eric J. Li | 2019-03-05 |
| 10199354 | Die sidewall interconnects for 3D chip assemblies | Digvijay A. Raorane | 2019-02-05 |