Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510667 | Conductive coating for a microelectronics package | Chung-Hao Chen, Emile Davies-Venn, Kemal Aygun, Mitul Modi | 2019-12-17 |
| 10244632 | Solder resist layer structures for terminating de-featured components and methods of making the same | Chi-Te Chen, Wei-Lun Kane Jen, Olivia Chen, Yun Ling | 2019-03-26 |