Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10244632 | Solder resist layer structures for terminating de-featured components and methods of making the same | Li-Sheng Weng, Wei-Lun Kane Jen, Olivia Chen, Yun Ling | 2019-03-26 |