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Variable ball height on ball grid array packages by solder paste transfer |
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Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate |
Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas |
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Electronic package assembly with compact die placement |
Vipul V. Mehta, Digvijay A. Raorane |
2019-08-06 |
| 10325866 |
Electronic device packages with conformal EMI shielding and related methods |
Joshua D. Heppner, Rajendra C. Dias, Mitul Modi |
2019-06-18 |
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Variable ball height on ball grid array packages by solder paste transfer |
Jimin Yao, Shawna M. Liff |
2019-04-09 |
| 10256198 |
Warpage control for microelectronics packages |
Guotao Wang, Huiyang Fei, Sairam Agraharam, Omkar G. Karhade, Nitin A. Deshpande |
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| 10249515 |
Electronic device package |
Jimin Yao, Shawna M. Liff |
2019-04-02 |
| 10224223 |
Low temperature thin wafer backside vacuum process with backgrinding tape |
— |
2019-03-05 |
| 10224290 |
Electromagnetically shielded electronic devices and related systems and methods |
Rajendra C. Dias, Takashi Kumamoto, Yoshishiro Tomita, Mitul Modi, Joshua D. Heppner |
2019-03-05 |