Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504863 | Variable ball height on ball grid array packages by solder paste transfer | Jimin Yao, Shawna M. Liff | 2019-12-10 |
| 10418329 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas | 2019-09-17 |
| 10373888 | Electronic package assembly with compact die placement | Vipul V. Mehta, Digvijay A. Raorane | 2019-08-06 |
| 10325866 | Electronic device packages with conformal EMI shielding and related methods | Joshua D. Heppner, Rajendra C. Dias, Mitul Modi | 2019-06-18 |
| 10256205 | Variable ball height on ball grid array packages by solder paste transfer | Jimin Yao, Shawna M. Liff | 2019-04-09 |
| 10256198 | Warpage control for microelectronics packages | Guotao Wang, Huiyang Fei, Sairam Agraharam, Omkar G. Karhade, Nitin A. Deshpande | 2019-04-09 |
| 10249515 | Electronic device package | Jimin Yao, Shawna M. Liff | 2019-04-02 |
| 10224223 | Low temperature thin wafer backside vacuum process with backgrinding tape | — | 2019-03-05 |
| 10224290 | Electromagnetically shielded electronic devices and related systems and methods | Rajendra C. Dias, Takashi Kumamoto, Yoshishiro Tomita, Mitul Modi, Joshua D. Heppner | 2019-03-05 |