Eric J. Li — 9 Patents at Intel

Issued Patents 2019

Showing 1–9 of 9 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10504863	Variable ball height on ball grid array packages by solder paste transfer	Jimin Yao, Shawna M. Liff	2019-12-10	$22,400,000
10418329	Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate	Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas	2019-09-17	$19,673,000
10373888	Electronic package assembly with compact die placement	Vipul V. Mehta, Digvijay A. Raorane	2019-08-06	$15,127,000
10325866	Electronic device packages with conformal EMI shielding and related methods	Joshua D. Heppner, Rajendra C. Dias, Mitul Modi	2019-06-18	$21,210,000
10256205	Variable ball height on ball grid array packages by solder paste transfer	Jimin Yao, Shawna M. Liff	2019-04-09	$21,845,000
10256198	Warpage control for microelectronics packages	Guotao Wang, Huiyang Fei, Sairam Agraharam, Omkar G. Karhade, Nitin A. Deshpande	2019-04-09	$21,845,000
10249515	Electronic device package	Jimin Yao, Shawna M. Liff	2019-04-02	$26,887,000
10224223	Low temperature thin wafer backside vacuum process with backgrinding tape	—	2019-03-05	$19,977,000
10224290	Electromagnetically shielded electronic devices and related systems and methods	Rajendra C. Dias, Takashi Kumamoto, Yoshishiro Tomita, Mitul Modi, Joshua D. Heppner	2019-03-05	$19,977,000