Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438930 | Package on package thermal transfer systems and methods | Omkar G. Karhade, Christopher L. Rumer, Robert M. Nickerson | 2019-10-08 |
| 10403512 | Low cost package warpage solution | Omkar G. Karhade, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2019-09-03 |
| 10256198 | Warpage control for microelectronics packages | Eric J. Li, Guotao Wang, Huiyang Fei, Sairam Agraharam, Omkar G. Karhade | 2019-04-09 |
| 10229882 | Embedded multi-device bridge with through-bridge conductive via signal connection | Omkar G. Karhade | 2019-03-12 |
| 10192810 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Omkar G. Karhade, Rajendra C. Dias, Edvin Cetegen, Lars D. Skoglund | 2019-01-29 |