LS

Lars D. Skoglund

IN Intel: 1 patents #2,309 of 5,769Top 45%
Overall (2019): #374,779 of 560,194Top 70%
1
Patents 2019

Issued Patents 2019

Patent #TitleCo-InventorsDate
10192810 Underfill material flow control for reduced die-to-die spacing in semiconductor packages Omkar G. Karhade, Nitin A. Deshpande, Rajendra C. Dias, Edvin Cetegen 2019-01-29