| 10461003 |
Electronic package that includes multiple supports |
Kedar Dhane |
2019-10-29 |
| 10438930 |
Package on package thermal transfer systems and methods |
Christopher L. Rumer, Nitin A. Deshpande, Robert M. Nickerson |
2019-10-08 |
| 10403512 |
Low cost package warpage solution |
Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita |
2019-09-03 |
| 10290561 |
Thermal interfaces for integrated circuit packages |
Edvin Cetegen, Kedar Dhane, Chandra Mohan Jha |
2019-05-14 |
| 10256198 |
Warpage control for microelectronics packages |
Eric J. Li, Guotao Wang, Huiyang Fei, Sairam Agraharam, Nitin A. Deshpande |
2019-04-09 |
| 10229882 |
Embedded multi-device bridge with through-bridge conductive via signal connection |
Nitin A. Deshpande |
2019-03-12 |
| 10192810 |
Underfill material flow control for reduced die-to-die spacing in semiconductor packages |
Nitin A. Deshpande, Rajendra C. Dias, Edvin Cetegen, Lars D. Skoglund |
2019-01-29 |