Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461003 | Electronic package that includes multiple supports | Kedar Dhane | 2019-10-29 |
| 10438930 | Package on package thermal transfer systems and methods | Christopher L. Rumer, Nitin A. Deshpande, Robert M. Nickerson | 2019-10-08 |
| 10403512 | Low cost package warpage solution | Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2019-09-03 |
| 10290561 | Thermal interfaces for integrated circuit packages | Edvin Cetegen, Kedar Dhane, Chandra Mohan Jha | 2019-05-14 |
| 10256198 | Warpage control for microelectronics packages | Eric J. Li, Guotao Wang, Huiyang Fei, Sairam Agraharam, Nitin A. Deshpande | 2019-04-09 |
| 10229882 | Embedded multi-device bridge with through-bridge conductive via signal connection | Nitin A. Deshpande | 2019-03-12 |
| 10192810 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Nitin A. Deshpande, Rajendra C. Dias, Edvin Cetegen, Lars D. Skoglund | 2019-01-29 |