Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461011 | Microelectronics package with an integrated heat spreader having indentations | Nicholas Neal, David W. Mendel, Kelly Lofgreen | 2019-10-29 |
| 10290561 | Thermal interfaces for integrated circuit packages | Edvin Cetegen, Omkar G. Karhade, Kedar Dhane | 2019-05-14 |